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Session 3: Inspection & Test 10:30am - 12:30pm
Session 6: New Methods & Materials 3:00pm - 4:30pm
KEYNOTE 1: Growth of WLSI and Wafer Foundry with Moore's Law and... 9:00am - 10:00am
Session 1: Package Reliability & Performance 10:30am - 12:30pm
KEYNOTE 2: Monolithic versus Heterogeneous Packaging: Where Does... 1:45pm - 2:45pm
Session 4: Advancements in WLP Integration Technology 3:00pm - 4:30pm
Networking Reception 4:30pm - 6:00pm
Session 2: Processing Technologies 10:30am - 12:30pm
Session 5: Advanced Technologies 3:00pm - 4:30pm
Lunch 12:30pm - 1:30pm
Session 9: Process & Technology 10:30am - 12:00pm
Session 12: Process & Technology II 1:30pm - 3:30pm
KEYNOTE 3: Interconnected World and the Automotive Paradigm 9:00am - 10:00am
Session 7: Wafer Level Fan-Out Process & Metrology 10:30am - 12:00pm
Session 10: Panel Level Fan-Out Packaging 1:30pm - 3:30pm
PANEL DISCUSSION: What is the Sweet Spot for Large Area (Panel)... 4:00pm - 5:00pm
Session 8: Processing & Materials 10:30am - 12:00pm
Session 11: Wafer Bonding Applications 1:30pm - 3:30pm
PDC1: Fan Out Packaging - Technology Evolution 8:30am - 12:00pm
PDC3: Fan-Out Wafer/Panel-Level Packaging for 3D IC Heterogeneous Integration 1:30pm - 5:00pm
PDC2: Modeling Failure Modes for Chip package Interactions and Package Level Reliability 8:30am - 12:00pm
PDC4: Polymers and Processes Used in Wafer Level Packaging 1:30pm - 5:00pm
