Loading…
This event has ended. Visit the official site or create your own event on Sched.
Back To Schedule
Wednesday, October 24 • 1:30pm - 3:30pm
Session 10: Panel Level Fan-Out Packaging

Sign up or log in to save this to your schedule, view media, leave feedback and see who's attending!

Tweet Share
Feedback form is now closed.
Recent Developments in Panel Level Packaging
Tanja Braun, Dr.-Ing, Fraunhofer IZM

Fabrication of Redistribution Structure Using Highly Reliable Photosensitive Polyimide for Fan Out Panel Level Packages
Hitoshi Araki, Ph.D., Toray Industries

Redistribution-Layers (RDLs) for Fan-Out Panel-Level Packaging
John Lau, Ph.D., ASM

Study of Fine Pitch RDL first FO-PLP/WLP
Hitoshi Onozeki, Hitachi Chemical
Wednesday October 24, 2018 1:30pm - 3:30pm PDT
Oak
  Track 1: WLP