IWLPC 2018

Thermal Debonding and Warpage Adjust of FOWLP – a Crucial Step in the Evolution of Advanced Packaging?
Klemens Reitinger, ERS

Degas Module Thermal Architecture, Variable Wafer Delays, and Throughput, Productivity, and Consistency in Fan-Out Packaging Barrier/Seed Layer PVD
Paul Werbaneth, Intevac, Inc.

Significant Advancement in Laser Ablative Release Layer Material Design Enabling Low-Energy and Low-Residue Debond
Luke Prenger, Brewer Science

Failure Relief in FOWLP Polymer Layers
Robert Hubbard,Ph.D., Lambda Technologie, Inc.